red semiconductor laser,
660 nm wavelength for both models;
blue or UV semiconductor laser,
450 or 405 nm wavelength (BLUE version)
only for 16/48 model
Output power, mW
Laser safety class
Power supply, V
3.7 V, Li-ion battery, 4 mAh
Power consumption, W
1 ... 1.5
20 g / 10…1000 Hz, 6 hours for each of XYZ axes
30 g / 6 ms
Operating ambient temperature, °С
-10 … +60
Permissible ambient light, lx
Relative humidity, %
5-95 (no condensation)
Storage temperature, °С
-20 … +70
NOTE: Parameters of probes (range of controlled diameters, length) can be changed upon request.
The main component of the probe is a laser sensor. Operation of the laser sensor is
based on the principle of optical triangulation (Figure 1). The sensor contains a
semiconductor laser (1) with the forming optics (2), the receiving lens (3), the CMOS array
(4), and the controller (5).
Radiation of a semiconductor laser is focused by the lens onto the object (6).
Radiation reflected by the object is collected by the lens onto the CMOS array. Moving the
object (6 - 6') causes the corresponding shift of the image. A signal processor calculates
the distance to the object from the position of the light spot on the CMOS array.
The laser sensor is characterized by a base distance (the distance from the probe
body to the beginning of the working range) and the working range (the distance
The measuring principle is illustrated in Figure 2. The laser probe is inserted into
the controlled hole. The probe (or the part) starts rotating at a constant speed. A
triangulation laser sensor, which is built into the probe, measures the distance to the hole
surface. The resulting set of coordinates is used to calculate the geometric parameters of
the hole. Moving the probe along the hole allows you to get the geometric parameters of the
hole in different sections and build a 3D model of the inner surface.
ID measuring system RF609-9/19-139-Wi-Fi
Example of item designation when ordering
Blue laser option (405 nm or 450 nm). Only for 16/48 probes
Minimum controlled diameter, mm
Maximum controlled diameter (when the probe is placed along the hole axis), mm
Probe length (prior consultation with the manufacturer is required)
Example: RF609-9/19-100-Wi-Fi — Laser Probe with a red semiconductor laser, range of controlled diameters - 9...19 mm, probe length - 100 mm, Wi-Fi interface.